The information about Samsung snapping a sophisticated packaging order for Nvidia’s AI chips paired with high-bandwidth reminiscence (HBM) chips underscores the strategic significance of next-generation packaging options. Based on a report printed in South Korean media outlet The Elec, Samsung’s superior packaging staff will present interposer and a couple of.5D packaging know-how for Nvidia’s AI processors.
It’s essential to notice that the GPU and HBM constructing blocks in these AI processors are provided by different firms—most definitely Nvidia’s GPUs manufactured on a TSMC course of node and HBM chips designed and produced by Samsung’s archrival SK hynix.
What’s extra essential is how business watchers relate this improvement to the inadequate capability of TSMC’s chip-on-wafer-on-substrate (CoWoS) know-how, which stacks chips and packages them onto a substrate. Nonetheless, this provide scarcity related with the latest earthquake in Taiwan doesn’t maintain a lot weight, and it’s most definitely associated to provide and demand points.
Samsung calls its 2.5D packaging know-how iCube; it locations a number of logic dies reminiscent of CPUs and GPUs and a number of other HBM dies on prime of a silicon interposer, making a number of dies function as a single chip in a single bundle. It deploys parallel and horizontal chip placement to spice up efficiency and fight warmth buildup.
Determine 1 The iCube know-how provides warpage management even with massive interposers, and its ultra-low sign loss is paired with excessive reminiscence density. Supply: Samsung
Samsung’s superior packaging pivot
Commerce media has been abuzz with stories about Samsung beefing up its superior packaging division by hiring extra engineers and creating its personal interposer know-how. The corporate reportedly procured a considerable amount of 2.5D packaging gear from Japanese semiconductor gear provider Shinkawa.
One other report printed in The Elec claims that Utilized Supplies and Besi Semiconductor are putting in hybrid bonding gear at Samsung’s Cheonan Campus. Hybrid bonding enhances I/O and wiring lengths in comparison with current bonding strategies. TSMC provides hybrid bonding in its 3D packaging companies referred to as System on Built-in Chip (SoIC). Intel has additionally carried out hybrid bonding know-how in its 3D packaging know-how referred to as Foveros Direct.
Media stories recommend that Samsung has lately ramped up the manufacturing capability at its key web site for superior manufacturing in Cheonan to full utilization previous Nvidia’s superior packaging orders. Trade observers additionally count on that this superior packaging cope with Nvidia may pave the best way for Samsung to win the provision of HBM chips for pairing with GPU’s maker’s AI units.
SK hynix is at the moment the most important provider of HBM chips for Nvidia’s AI processors, and Samsung is frantically working to shut the hole. In reality, when Samsung established the superior packaging enterprise staff in December 2023, the corporate’s co-CEO Kye-Hyun Kyung hinted about seeing the outcomes of this funding within the second half of 2024.
Superior packaging in Samsung’s roadmap
Kyung additionally pinned his hopes on a aggressive benefit with Samsung’s reminiscence chips, chip fabrication, and chip design companies beneath one roof. Superior packaging stands out on this semiconductor know-how portfolio as a consequence of its intrinsic hyperlink to massive and highly effective AI chips and system-in-package (SiP) units.
Determine 2 Subsequent-generation packaging applied sciences are within the limelight as a result of huge demand for AI chips. Supply: Samsung
Like TSMC and Intel Foundry, Samsung is aggressively investing in superior packaging applied sciences like silicon interposers whereas additionally steadily increasing its manufacturing capability. Attention-grabbing occasions are forward for next-generation packaging options.
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The publish Samsung’s superior packaging pivot with Nvidia manufacturing win appeared first on EDN.
