Microchip’s RTG4 FPGAs With Lead-Free Flip-Chip Bumps Obtain Highest House Qualification

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QML Class V designation acknowledges distinctive reliability and longevity for vital house missions Satisfying mission assurance necessities for essentially the most vital house packages, Microchip Expertise’s Radiation-Tolerant (RT) RTG4 Subject- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Certified Producers Checklist (QML) Class V standing. As designated by the Protection Logistics Company (DLA), QML Class V is the best degree of qualification for house elements and a essential step to fulfill mission assurance necessities on essentially the most vital house missions akin to human-rated, deep house and nationwide safety packages. As a result of QML {qualifications} are standardized primarily based on particular efficiency and high quality necessities ruled by the DLA, clients can streamline their design and certification processes through the use of QML- certified merchandise.

In 2018, RTG4 FPGAs grew to become the primary RT FPGAs providing greater than 150,000 logic parts to realize a QML Class V qualification, and this next-generation answer with lead-free flip-chip bumps is the primary of its sort to realize QML Class V standing. In superior flip-chip bundle building, akin to that used within the RTG4 FPGA, flip-chip bumps are utilized to attach the silicon die and the bundle substrate. Lead- free bump materials will assist prolong the longevity of the product, which is vital to house missions.

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“That is one other milestone for our RTG4 FPGAs that may present clients with added confidence in designing these gadgets in house flight methods, whereas permitting them to reap the benefits of our high- reliability, zero-configuration-upset and low-power consumption FPGAs,” mentioned Bruce Weyer, company vice chairman for Microchip’s FPGA enterprise unit. “For greater than 60 years, Microchip options have powered house flight missions, and we’re devoted to product longevity and offering the best high quality options.”

RTG4 FPGAs are designed to convey excessive ranges of density and efficiency to house purposes, saving value and engineering efforts via low energy consumption and immunity to configuration upsets. Not like SRAM-based FPGA alternate options, the programming know-how utilized in RTG4 FPGAs gives low static energy, which assists in managing thermal points frequent in spacecraft. RTG4 FPGAs eat solely a fraction of the entire energy in comparison with equal SRAM FPGAs, whereas exhibiting zero configuration upsets in radiation and thus requiring no mitigation, decreasing engineering bills and complete system prices.

To attain QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone in depth reliability testing, enduring as much as 2,000 thermal cycles from −65ºC to 150°C junction temperature. The lead-free flip-chip bump interface connections handed MIL-PRF-38535 inspection standards and exhibited no indicators of tin whiskers. The flip-chip bump is contained in the FPGA bundle, so there is no such thing as a affect on the person’s design, reflow profile, thermal administration or board meeting circulation when changing to lead-free bump RTG4 FPGAs.

Microchip boasts one of many trade’s most complete house product portfolios of radiation- hardened and RT options that embrace QML Class Q RT PolarFire FPGAs and sub-QML FPGAs that bridge the hole between conventional Certified Producers Checklist (QML) elements and Business Off-The- Shelf (COTS) elements. For a complete itemizing of Microchip FPGA and mixed-signal half numbers alongside their corresponding Protection Logistics Company (DLA) drawing numbers, please seek advice from the DLA Cross Reference Information.

Growth Instruments

The RTG4 FPGAs are supported by improvement kits, mechanical samples and daisy chain packages for board validation and testing. Libero SoC Design Suite permits RTL entry via programming and features a wealthy IP library, full reference designs and improvement kits.