Categories: Electronics

Intel bolsters EMIB packaging with EDA instruments enablement

Intel’s embedded multi-die interconnect bridge (EMIB) expertise—aiming to handle the rising complexity in heterogeneously built-in multi-chip and multi-chip (let) architectures—made waves at this 12 months’s Design Automation Convention (DAC) in San Francisco, California. It delivers superior built-in IC packaging options that embody planning, prototyping, and signoff throughout a broad vary of integration applied sciences equivalent to 2.5D and 3D IC.

At DAC, Intel exhibited tie-ups with key EDA and IP companions to make sure that their heterogenous design instruments, flows and methodologies, and reusable IP blocks are absolutely enabled and certified to assist EMIB meeting expertise.

Determine 1 A silicon bridge is embedded inside a bundle to attach a number of dies. Supply: Intel

On the coronary heart of those initiatives was Intel Foundry’s Package deal Meeting Design Equipment (PADK), which allows engineers to create EMIB-based bundle designs. Intel’s PADK—comprising a design information, guidelines, and stack-up that allow chip designers to finish and confirm an EMIB design effectively—goals to handle chip design complexity and facilitate EDA device enablement.

PADK allows reference flows that assist instruments from all main EDA distributors to facilitate a PADK-driven meeting verification. Under is a sneak peek at Intel’s Foundry’s current collaborations with main EDA distributors for EMIB enablement.

Collaboration with EDA trio

Simens EDA

At DAC 2024, Siemens EDA introduced device certifications for EMIB enablement for designing extremely advanced ICs and superior packaging. The certifications embrace Solido SPICE—a part of the Solido Simulation Suite software program—for the foundry’s Intel 16 and Intel 18A course of nodes.

Earlier, in February 2024, Siemens EDA introduced the supply of the EMIB reference circulation to permit design engineers perform early bundle meeting prototyping, hierarchical system floorplanning, co-design optimization, and verification of the entire detailed implementation. The reference circulation, constructed round Intel Foundry’s PADK, allows engineers to sort out the complete vary of vital duties wanted for a profitable design and tape-out.

Determine 2 The EMIB reference circulation allows design engineers to create high-density interconnect for heterogeneous chips. Supply: Siemens EDA

Synopsys

Synopsys additionally exhibited a multi-die reference circulation for Intel Foundry on the DAC 2024 ground. Powered by Synopsys.ai EDA suite, it goals to offer designers with a complete and scalable answer for quick heterogeneous integration utilizing EMIB meeting expertise.

The reference circulation, enabled by Synopsys 3DIC Compiler, offers a unified co-design and evaluation answer to speed up the event of multi-die designs in any respect levels from silicon to methods. Furthermore, Synopsys 3DSO.ai, which is natively built-in with Synopsys 3DIC Compiler, allows optimization for sign, energy, and thermal integrity.

Ansys, a provider of electrothermal instruments at the moment within the strategy of being acquired by Synopsys, can also be offering multi-physics signoff options for Intel’s 2.5D chip meeting expertise, which makes use of EMIB expertise to attach the die flexibly and with out the necessity for through-silicon vias (TSVs). Its RedHawk-SC Electrothermal EDA platform allows multi-physics evaluation of two.5D and 3D ICs with a number of dies.

Cadence Design Programs

Cadence, one other member of EDA trio, has additionally joined arms with Intel Foundry to certify an built-in superior packaging circulation using EMIB expertise to handle the rising complexity in heterogeneously built-in multi-chip(let) architectures. This EMIB circulation allows design groups to seamlessly transition from early-stage system-level planning, optimization and evaluation to DRC-aware implementation, and bodily signoff with out changing information between completely different codecs.

EDA device enablement

Intel, which has led the packaging expertise growth curve for a few many years, has now launched two superior packaging applied sciences to scale silicon space by connecting a number of dies in a single bundle. Whereas EMIB connects a number of chips aspect by aspect in a bundle, chips are stacked on high of each other in a 3D vogue in Foveros.

Rahul Goyal, VP and GM for product and design ecosystem enablement at Intel, says EMIB expertise embodies a differentiated strategy to multi-die meeting in comparison with conventional stacking methods. Intel has already applied EMIB expertise in its personal chips, together with GPU Max Sequence (code-named Ponte Vecchio), 4th Gen Intel Xeon and Xeon 6 processors, and Intel Stratix 10 FPGAs.

Determine 3 Intel Foundry developed EMIB to attach a number of dies in a single bundle. Supply: Intel

Nonetheless, EMIB, like different superior packaging applied sciences, presents new challenges associated to the design and packaging complexities of multi-die architectures. So, incorporating a wide range of EDA instruments into Intel’s PADK is an efficient begin. It is going to assist chip designers implement and confirm EMIB designs successfully and effectively.

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