This 12 months throughout APEC, a lot of the concentrate on the present ground revolved round information middle tech, with corporations showcasing high-density energy provide items (PSU), battery backup items (BBU), intermediate bus converters (IBC), and GPU options (Determine 1).
The motivation comes from the huge energy demand improve that the generative AI, specifically, LLMs have introduced on, taking pictures up the two% of world energy consumption from information facilities to a projected 7% by 2030. This energy demand originates from the shift from the extra 120 kV (single-phase AC) stepped right down to 48 V to 250-350 kV (three-phase AC) stepped right down to 400 VDC rails hooked up to the rack and distributed from there (to switches, PSUs, compute trays, swap trays, BBUs, and GPUs).
Infineon’s sales space introduced a complete suite of options from the “energy grid to the core.” The BBU expertise (Determine 2) makes use of the partial energy converter (PPC) topology to allow excessive energy densities (> 12 kW) utilizing scalable 4 kW energy converter playing cards.
Determine 2: Infineon BBU roadmap, utilizing each Si and GaN to scale up the ability density of the converters with excessive efficiencies. Supply: Infineon
The expertise boasts an effectivity of 99.5% utilizing decrease voltage (40 V and 80 V) switches to extend determine of advantage (FOM) and yield effectivity positive aspects. The options are aimed toward assembly space-restrictions of recent BBUs which can be outfitted with an increasing number of batteries and therefore much less area for the embedded DC/DC converter.
Their newest era of vertical energy supply modules characteristic a leap in GPU/AI card energy supply, providing as much as 2 A/mm2. These enhancements create huge space-savings on the already space-constrained AI playing cards that usually require 2000 A to 3000 A for power-hungry chips such because the Nvidia Blackwell GPU.
As an alternative of being mounted laterally, or alongside the chip, these units ship energy on the underside of the cardboard to massively scale back energy supply losses. The bottom mounting does include its profile restraints; there’s a max peak of 5 mm to facilitate heatsink mounting on the opposite facet of the board, so these modules should keep their 4-mm peak.
The primary era of the dual-phase module featured the silicon gadget that sat on prime of the substrate with built-in inductors and capacitors to realize 1 A/mm2, or 140A max, in a ten x 9 mm bundle. This was adopted by a dual-phase module that featured a 1.5 A/mm2, or 160 A max, enchancment inside 8 x 8 mm dimensions. Embedding the silicon into the substrate to have just one PCB is what contributed to the most important space-savings on this iteration (Determine 4).
Determine 4: The second era of Infineon vertical energy supply modules mounted on the bottom of GPU PCB ship a complete of 2000 A. An Infineon controller IC may also be seen offering the required voltage/present by way of coordination with the vertical energy supply modules and chip.
The third era simply launched has introduced on two extra energy phases for a quad-phase module for two A/mm2, or 280 A max, within the 10 x 9 mm area; doubling the present density of the primary era in the identical area (Determine 5).
Determine 5: Third era of Infineon vertical energy supply modules are mounted on the bottom of GPU PCB delivering a complete of two,000 A.
Customized options can transcend this, integrating extra energy phases in a single substrate. Different enhancements embody bypassing the motherboard and direct-attaching to the substrate within the GPU since PCB substrate supplies are lossy for indicators with excessive present densities.
Nonetheless, this requires nearer collaboration with SoC distributors which can be prepared to implement system-level options. Excessive present density options are within the works with Infineon, probably doubling the present density with one other multi-phase module.
The Navitas sales space additionally confirmed two type elements of PSUs: a typical redundant energy provide (CRPS) type issue and an extended PSU that meets open compute venture (OCP) tips and compiled to the ORv3 base specification (Determine 6). The CRPS answer delivers 4.5 kW with two-stages together with a SiC PFC finish and GaN LLC and provides titanium stage effectivity.
Determine 6: Typical rack is proven with RAM, GPU, PSUs, and airflow outlet with barrel followers. The PSUs conform to the CRPS and supply redundancy to encourage zero downtime within the occasion of transient faults, brownouts, and blackouts.
Hyperscalers or excessive efficiency compute (HPC) purposes that make the most of the OCP structure can set up PSUs in a row to centralize energy within the rack. The Navitas PSU supplied for this datacenter topology provides as much as 8.5 kW with as much as a 98% effectivity utilizing a three-phase interleaved CCM totem pole SiC PFC and three-phase GaN LLC (Determine 7).
Determine 7: Navitas 8.5 kW PSU is geared towards hyperscalers utilizing each Gen-3 Quick SiC and GaNSafe units.
Aalyia Shaukat, affiliate editor at EDN, has labored within the design publishing trade for six years. She holds a Bachelor’s diploma in electrical engineering from Rochester Institute of Know-how, and has printed works in main EE journals in addition to commerce publications.
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